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International Conference on

Semiconductors, Optoelectronics and Nanostructures

THEME: "Advancing Semiconductor Science for a Smarter Future"

img2 29-30 Mar 2027
img2 Berlin, Germany

Advanced Semiconductor Packaging and Heterogeneous Integration

This session addresses system-level scaling approaches such as chiplets, 2.5D/3D integration, advanced interconnects, and thermal management strategies. It reflects the industry shift from transistor scaling to system-level integration.

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